46235-0002, Контакт, Серия Micro-Fit 3.0, Гнездо, Обжим, 20 AWG, Контакты с Покрытием из Золота

Разъемы\Штекерные и Гнездовые Разъемы и Компоненты\Контакты Штекерных и Гнездовых РазъемовThe Micro-Fit 3.0 series Connector is a 3mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 8.5A to meet low- to mid-range power application needs. Molex's Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. These can be purchased in pure tin or one of two thicknesses of select gold. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. • Fully isolated contacts• Full polarization• Positive locks• UL94V-0 Flammability