2367198-3, Wire-to-Board Housing

1.0MM Centerline Locking HPI SolutionsTE Connectivity's 1.0MM Centerline Locking High Performance Interconnect (HPI) Solutions offer right angle and vertical PCB mounting orientations and 3 to 15 position sizes. The locking feature strengthens the mating connection between the plug assembly and the receptacle, helping alleviate accidental unmating from pulling. Gold plating is available and protects against erosion in harsh environment applications. TE 1.0MM HPI Solutions are ideal for drones, printers, home appliances, and consumer electronics.