IRF100S201

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Trans MOSFET N-CH 100V 192A 3-Pin(2+Tab) D2PAK T/R
Вес и габариты
automotiveNo
channel modeEnhancement
channel typeN
1 030
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Бонус: 20.6 !
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Итого: 1 030
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Trans MOSFET N-CH 100V 192A 3-Pin(2+Tab) D2PAK T/R
Вес и габариты
automotiveNo
channel modeEnhancement
channel typeN
configurationSingle
continuous drain current (id) @ 25в°c192A(Tc)
eccn (us)EAR99
eu rohsCompliant with Exemption
lead shapeGull-wing
maximum continuous drain current (a)192
maximum diode forward voltage (v)1.3
maximum drain source resistance (mohm)4.2 10V
maximum drain source voltage (v)100
maximum gate source leakage current (na)100
maximum gate source voltage (v)±20
maximum gate threshold voltage (v)4
maximum idss (ua)20
maximum junction ambient thermal resistance on pcb (°c/w)40
maximum operating temperature (°c)175
maximum positive gate source voltage (v)20
maximum power dissipation (mw)441000
maximum pulsed drain current @ tc=25°c (a)690
minimum gate threshold voltage (v)2
minimum operating temperature (°c)-55
mountingSurface Mount
number of elements per chip1
operating junction temperature (°c)-55 to 175
packagingTape and Reel
part statusActive
pcb changed2
pin count3
power dissipation-max (ta=25в°c)441W(Tc)
ppapNo
process technologyHEXFET
product categoryPower MOSFET
rds on - drain-source resistance4.2mО© @ 115A,10V
standard package nameTO-263
supplier packageD2PAK
tabTab
transistor polarityN Channel
typical fall time (ns)100
typical gate charge @ 10v (nc)170
typical gate charge @ vgs (nc)170 10V
typical gate plateau voltage (v)4.4
typical gate to drain charge (nc)45
typical gate to source charge (nc)46
typical input capacitance @ vds (pf)9500 50V
typical output capacitance (pf)660
typical reverse recovery charge (nc)90
typical reverse recovery time (ns)47
typical reverse transfer capacitance @ vds (pf)310 50V
typical rise time (ns)97
typical turn-off delay time (ns)110
typical turn-on delay time (ns)17
vds - drain-source breakdown voltage100V
vgs - gate-source voltage4V @ 250uA
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