HSS-B20-0635H-02, Stamped Heat Sink, TO-220, 6.35 mm Horizontal Solder Pin
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Thermal Management SolutionsCUI Devices Thermal Management Solutions are vital to system performance by reducing unwanted heat. CUI Devices Thermal Management line addresses the increasing thermal challenges in today's board-level electronic applications, encompassing a range of DC axial fans, blowers, heat sinks, Peltier thermoelectric cooling (TEC) devices, and thermal accessories.
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